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  cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 1/6 DTA144WA3 cystek product specification pnp digital transistors (built-in resistors ) DTA144WA3 features ? built-in bias resistors enable the co nfiguration of an inverter circu it without connecting external input resistors (see equivalent circuit). ? the bias resistors consist of thin-f ilm resistors with complete isolati on to allow positive biasing of the input. they also have the advantage of almost completely eliminating parasitic effects. ? only the on/off conditions need to be set for operation, making device design easy. ? complements the dtc144wa3 ? pb-free lead plating an d halogen-free package equivalent circuit outline to-92 DTA144WA3 r1=47k , r2=22 k in(b) : base out(c) : collector gnd(e) : emitter e c b
cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 2/6 DTA144WA3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit supply voltage v cc -50 v collector-base voltage v cbo -50 v collector-emitter voltage v ceo -50 v emitter-base voltage v ebo -10 v input voltage v i -40~+10 v i o -100 ma output current i o(max.) -100 ma power dissipation @ t a =25 c p d 500 mw thermal resistance, junction to ambient r ja 250 c/w junction temperature tj 150 c storage temperature tstg -65~+150 c operating ambient temperature tamb -65~+150 c electrical characteristics (ta=25 c) parameter symbol min. typ. max. unit test conditions v i(off) - -1.7 -1.2 v v cc =-5v, i o =-100 a input voltage v i(on) -4 -2.4 - v v o =-0.3v, i o =-2ma output voltage v o(on) - -90 -150 mv i o =-10ma, i i =-0.5ma input current i i - - -0.16 ma v i =-5v output current i o(off) - - -100 na v cc =-50v, v i =0v collector base cutoff current i cbo - - -100 na v cb =-50v, i e =0a collector emitter cutoff current i ceo - - -500 na v ce =-50v, i b =0a dc current gain g i 60 - - - v o =-5v, i o =-5ma input resistance r 1 32.9 47 61.1 k - resistance ratio r 2 /r 1 0.37 0.47 0.57 - - transition frequency f t - 250 - mhz v ce =-10v, i c =-5ma, f=100mhz * * transition frequency of the device ordering information device package shipping marking DTA144WA3 to-92 (pb-free lead plating an d halogen-free package) 2000 pcs / tape & box a144w
cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 3/6 DTA144WA3 cystek product specification characteristic curves current gain vs output current 1 10 100 1000 0.1 1 10 100 output current---i o (ma) current gain---g i v o = 5v output voltage vs output current 10 100 1000 10000 1 10 100 output current---io(ma) output voltage---vo(mv) input voltage vs output current(on characteristics) 1 10 0.1 1 10 output current---i o (ma) input voltage---v i(on) (v) v o = 0.3v output current vs input voltage(off characteristics) 0.01 0.1 1 10 012345 input voltage ---v i(off) (v) output current---i o (ma) v cc = 5v power derating curve 0 100 200 300 400 500 600 0 50 100 150 200 ambient temperature---t a () power dissipation---p d (mw)
cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 4/6 DTA144WA3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 5/6 DTA144WA3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 265 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 150 c 200 c 60-120 seconds 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) ? time (t l ) 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 265 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c276a3 issued date : 2009.09.22 revised date : page no. : 6/6 DTA144WA3 cystek product specification to-92 dimension a144w *: t y pical i n c h e s m i l l i m e t e r s i n c h e s m i l l i m e t e r s dim m i n . m a x . m i n . m a x . dim m i n . m a x . m i n . m a x . a 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 g 0.0142 0 . 0 2 2 0 0 . 3 6 0 . 5 6 b 0 . 1 7 0 4 0 . 1 9 0 2 4 . 3 3 4 . 8 3 h - * 0 . 1 0 0 0 - * 2.54 c 0 . 5 0 0 0 - 1 2 . 7 0 - i - * 0 . 0 5 0 0 - * 1.27 d 0 . 0 1 4 2 0 . 0 2 2 0 0 . 3 6 0 . 5 6 1 - * 5 - * 5 e - * 0 . 0 5 0 0 - * 1.27 2 - * 2 - * 2 f 0 . 1 3 2 3 0 . 1 4 8 0 3 . 3 6 3 . 7 6 3 - * 2 - * 2 note s: 1.controlling dimension: millimeter s. 2.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , please c ont act y our local c y s t ek sales of fice. material: ? lead: pur e tin plated ? mold compou n d : epoxy resin fa mily , flammabilit y solid burning cla ss: ul94v -0 im portan t n o tice : ? all rights are re served. reprod u c tion in w hole or in part is prohibited w i thout the p r ior w r itten a pprov al of c y stek. ? c y stek reserv es the right to m a ke changes to its products w i tho u t notice. ? cy st e k semic ond uct o r pr odu cts are n o t warr ante d t o be s u it able f o r use i n l i fe-su p p o rt a p p licatio ns, or sys tems. ? c y stek assumes no liability fo r an y consequenc e of customer pr oduct design, infringement of pat e n ts, or application assistance . marking: 3 1 a d b c i 1 e f 2 2 3 h g s t yle: pin 1.emitter 2.colle ctor 3.ba se 3-l ead t o -9 2 plastic pa ckag e cys t ek pa ck a g e code: a 3


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